电子产品制造工艺多场多尺度建模分析电子书

Preface

Chapter 1 Investigation on micro contact in Cu-Cu wire bonding process

1.1 Introduction

1.2 Molecular dynamics modeling of Cu-Cu wire bonding

1.3 Results and discussions

1.3.1 Formation and breakage processes of Cu-Cu weld

1.3.2 Analysis of Cu-Cu indentation morphology

1.3.3 Analysis of Cu-Cu atomic stress distribution

1.4 Conclusions

References

Chapter 2 Investigation on wire bonding performance with six typical material pairs

2.1 Introduction

2.2 Moleculardynamicsmodelingofsixmaterialpairs

2.3 Results and discussions

2.3.1 Analysis of bonding forces and system energy

2.3.2 Analysis of atomic morphology for six material pairs

2.3.3 Analysis of atomic stress distribution for six material pairs

2.3.4 Four critical displacement points of six material pairs

2.4 Conclusions

References

Chapter 3 Investigation on residual stress on chip of automobile pressure sensor in potting process

3.1 Introduction

3.2 Thermal experiment of MEMS pressure sensor

3.3 Analytic analysis of thermal stress on sensitive structure

3.4 Modeling and Simulation

3.4.1 Geometric model of MEMS pressure sensor

3.4.2 Finite element model of MEMS pressure sensor

3.4.3 Finite element simulation of residual stress

3.5 Conclusions

References

Chapter 4 Investigation on thermal cycle failure of wire bonding weld in automobile pressure sensor

4.1 Introduction

4.2 Thermal cycling experiments of the MEMS pressure sensor

4.2.1 A sample of thermal cycling test

4.2.2 Experimental methods of the thermal fatigue test

4.2.3 Experimental results and analysis under thermal cycles

4.3 Numerical simulation

4.3.1 Theoretical model of thermal fatigue

4.3.2 Geometric model of the MEMS pressure sensor

4.3.3 Simulation model of thermal fatigue of solder joint

4.3.4 Simulation results of solder joint failures

4.4 Conclusions

References

Chapter 5 Investigation on acoustic injection on automobile MEMS accelerometer

5.1 Introduction

5.2 Experimental investigation of acoustic injection

5.3 Modeling and simulation

5.3.1 Disassembly of inertial measurement unit (IMU) MPU6050

5.3.2 Geometric model of accelerometer unit

5.3.3 Finiteelementmodelofaccelerometersensitivestructure

5.3.4 Simulation results and discussion of acoustic injection

5.4 Conclusions

References

Chapter 6 Investigation on wetting behavior of Sn droplet on FPCB substrate surfaces

6.1 Introduction

6.2 Models and methods of different surfaces

6.2.1 Modified embed atom method (MEAM) potential

6.2.2 Simulation models of different surfaces

6.2.3 Experimental procedures of wetting behavior on different surfaces

6.3 Results and discussion

6.3.1 Effect of temperature on wetting behavior

6.3.2 Effect of roughness on wetting behavior

6.3.3 Effect of Sn surface on wetting behavior

6.3.4 Contact angle measurement on different substrate surfaces

6.4 Conclusions

References

Chapter 7 Investigation on etchant spraying characteristics in FPCB etching process

7.1 Introduction

7.2 Equipment of the FPCB etching process

7.3 Numerical simulation of multi-nozzle spraying system

7.3.1 Governing equations of fluid dynamics

7.3.2 Simulation model of spraying equipment

7.4 Results and discussions

7.5 Conclusions

References

Chapter 8 Investigation of etchant concentration distribution and fluid characteristics in FPCB etching cavity

8.1 Introduction

8.2 Model formulation and method of etching process

8.2.1 Governing equations of fluid dynamics and mass flux

8.2.2 Simulation model of the FPCB etching cavity

8.3 Results and discussions

8.4 Conclusions

References

Chapter 9 Investigation of etching cavity evolution in FPCB etching process

9.1 Introduction

9.2 Equipment of the FPCB etching process

9.3 NumericalsimulationoftheFPCBetchingprocess

9.3.1 Governing equations of the fluid dynamics

9.3.2 Simulation model of spraying and etching domain

9.4 Results and discussions

9.5 Conclusions

References

Appendix