1.书稿由国家973聚酰亚胺材料首席科学家杨士勇教授主编，全部由国内有关领域知名专家执笔，内容先、原创。 2.本书汇总了我国聚酰亚胺973课题研究的原创成果，反映了聚酰亚胺这一先材料在微电子领域、航空航天等领域的应用成果，在微电子领域，尤其是电子封装领域具有较高的使用价值。
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内容简介
Preface to the Series
Preface
List of Contributors
About the Editor
Chapter 1 Advanced Polyimide Films
1.1 Introduction
1.2 Chemistry of Polyimide Films
1.2.1 Thermal Imidization
1.2.2 Chemical Imidization
1.3 Thermal Curing of Polyimide Films
1.3.1 Thermal Imidization Process
1.3.2 Influence of Curing Temperatures on Film’s Properties
1.4 Structures and Properties of Polyimide Films
1.4.1 Advanced Polyimide Films
1.4.2 Low-CTE Polyimide Films
1.4.3 Transparent Polyimide Films
1.4.4 Atomic Oxygen-resistant Polyimide Films
1.5 Surface Modification of Polyimide Films
1.6 Applications of Polyimide Films
1.6.1 Electric Insulating Applications
1.6.2 Electronic and Optoelectronic Applications
1.6.3 Aerospace Applications
1.7 Summary
REFERENCES
Chapter 2 Advanced Polyimide Fibers
2.1 Introduction
2.2 Synthesis of Spinning Resin Solutions
2.2.1 “Two-Step” Polymerization Method
2.2.2 “One-Step” Polymerization Method
2.3 Preparation of Polyimide Fibers
2.3.1 Wet-Spinning Method
2.3.2 Dry-Spinning Method
2.3.3 Other-Spinning Methods
2.4 Structure and Properties of Polyimide Fibers
2.4.1 Aggregation Structure of Polyimide Fibers
2.4.2 Chemical Structure-Property Relationship
2.4.3 Properties of Polyimide Fibers
2.5 Applications of Polyimide Fibers
2.5.1 Production of Polyimide Fibers
2.5.2 Application of Polyimide Fibers
2.6 Summary
REFERENCES
Chapter 3 Polyimide Matrices for Carbon Fiber Composites
3.1 Introduction
3.2 NA-endcapped Thermoset Matrix Resins
3.2.1 Chemistry
3.2.2 Structures and Properties
3.3 PE-endcapped Oligoimide Resins
3.3.1 Chemistry
3.3.2 Structures and Properties
3.4 Properties of Polyimide/Carbon Fiber Composites
3.4.1 Preparation of PMR-type Resin Prepregs
3.4.2 Fabrication of Carbon Fiber Composites
3.4.3 Properties of NA-Endcapped Polyimide Composites by Autoclave
3.4.4 Properties of PE-Endcapped Polyimide Composites by Autoclave
3.4.5 Properties of PE-Endcapped Polyimide Composites by RTM
3.5 Applications of Polyimide/Carbon Fiber Composites
3.6 Summary
REFERENCES
Chapter 4 Super Engineering Plastics and Foams
4.1 Introduction
4.2 Compression-Molded Polyimide Materials
4.3 Injection and Extrusion Processed Polyimide Materials
4.4 Structures and Melt Processabilities of Aromatic Polyimide Resins
4.4.1 Polyimide Backbone Structures
4.4.2 Controlled Molecular Weights
4.5 Meltable Thermoplastic Polyimide Composites
4.6 Reactive End-Capped Meltable Polyimide Resins
4.6.1 NA-end-capped Meltable Polyimide Resins
4.6.2 PE-end-capped Meltable Polyimide Resins
4.7 Heat-Resistant Polyimide Foams
4.7.1 Introduction
4.7.2 Opened-Cell Soft Polyimide Foams
4.7.3 Closed-Cell Rigid Polyimide Foams
4.8 Thermally Stable Flexible Polyimide Aerogels
4.9 Summary
REFERENCES
Chapter 5 Polyimides for Electronic Applications
5.1 Introduction
5.2 Polyimide Materials for Microelectronics
5.2.1 Combined Property Requirements
5.2.2 Typical Applications
5.2.3 Structures and Properties of Polyimide Materials for Microelectronics
5.3 Polyimide Materials for Optoelectric Planar Displays
5.3.1 Liquid Crystal Alignment Layers
5.3.2 Mechanical Rubbing Alignment Polyimides
5.3.3 Photoinduced Alignment PIs
5.3.4 The Microgroove Polyimide Surfaces
5.3.5 Langmuir-Blodgett Polyimide Films
5.4 Polyimide Materials for Optoelectronic Flexible Displays
5.4.1 Combined Property Requirements
5.4.2 Polyimides for Flexible Electronic Substrates
5.5 Polyimide Materials for Electronic Memories
5.5.1 Introduction
5.5.2 Polyimides for Resistive-type Memory Devices
5.5.3 Polyimides for Transistor-type Memory Devices
5.6 Summary
REFERENCES
Chapter 6 Polyimide Gas Separation Membranes
6.1 Introduction
6.2 Mechanisms of Gas Separation and Testing Methods
6.2.1 Gas Transport Mechanism
6.2.2 Apparatus for Testing Gas Transport Properties
6.3 Structures and Properties of Polyimide Membranes
6.3.1 Isomer Structure Effects From Diamines
6.3.2 Substitution and Geometric Effects From Diamines
6.3.3 Chemical Structure Effects of Dianhydrides
6.4 Intrinsically Microporous Polyimide Membranes
6.5 Hydroxyl-functionalized Polyimide and Its Derived Polybenzoxazole Membranes
6.5.1 Hydroxyl-functionalized Polyimide Membranes
6.5.2 Thermally Rearranged Polybenzoxazole （TR-PBO） Membranes
6.5.3 Applications of TR-PBO Membranes
6.6 Polyimide-Derived Carbon Molecular Sieve Membranes
6.6.1 Formation of CMSMs
6.6.2 Conversion From Polyimide to CMSMs
6.6.3 Structures and Properties of CMSMs
6.7 In Summary
REFERENCES
Chapter 7 Polyimide Proton Exchange Membranes
7.1 Introduction
7.2 Monomer Synthesis
7.2.1 Synthesis of Sulfonated Diamines
7.2.2 Synthesis of Six-membered Ring Dianhydrides
7.3 Polyimide Preparations
7.3.1 Preparation From Sulfonated Diamines
7.3.2 Preparation From Sulfonated Dianhydrides
7.3.3 Synthesis via Postsulfonation
7.3.4 Block Copolymerization
7.4 Ion Exchange Membrane Properties
7.4.1 Solubility
7.4.2 Thermal Stability
7.4.3 Water Uptake and Swelling Ratios
7.4.4 Proton Conductivity
7.4.5 Water Resistance
7.4.6 Radical Oxidative Stability
7.4.7 Methanol Permeability
7.5 Fuel Cell Performance
7.6 Summary
REFERENCES
Chapter 8 Soluble and Low-k Polyimide Materials
8.1 Introduction
8.2 Structures and Properties of Soluble Aromatic Polyimides
8.2.1 Soluble Polyimides With Flexible Backbones
8.2.2 Soluble Polyimides With Asymmetric Structures
8.2.3 Soluble Polyimides With Alicyclic Structures
8.2.4 Soluble Polyimides With Side Groups
8.3 Applications of Soluble Aromatic PIs
8.3.1 Second-order Nonlinear Optical （NLO） Materials
8.3.2 Memory Device Materials
8.3.3 Compensator Materials for Liquid Crystal Displays
8.3.4 Gas Separation Materials
8.3.5 Other Applications
8.4 Low-k Polyimide Materials
8.4.1 Introduction
8.4.2 Impact Factors on Dielectric Properties ［143］
8.4.3 Structures and Dielectric Properties of Polyimides
8.4.4 Low-k Polyimides With Porous Structures
8.4.5 Organic–Inorganic Hybrid Polyimide Materials
8.4.6 Intrinsic Low-k Polyimide Materials
8.4.7 Summary
REFERENCES
Appendix Unit of Measurement Conversion Table
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